发明名称 WAFER, METHOD OF MANUFACTURING INTEGRATED CIRCUITS ON A WAFER, AND METHOD OF STORING DATA ABOUT SAID CIRCUITS
摘要 The invention discloses a wafer (2), comprising a plurality of integrated circuits (1) formed on the wafer (2); and at least one auxiliary integrated circuit (Ia) formed on the wafer (2); wherein data carrying information about said integrated circuits (1) are stored in said at least one auxiliary integrated circuit (Ia). Examples for said data are test results of a test performed on said individual integrated circuits (1) and/or a wafer identification or a product identification. The invention furthermore discloses a method of manufacturing said integrated circuits (1) and a method of storing said data about said circuits (1a).
申请公布号 WO2009034496(A3) 申请公布日期 2009.05.22
申请号 WO2008IB53499 申请日期 2008.08.29
申请人 NXP B.V.;SCHEUCHER, HEIMO 发明人 SCHEUCHER, HEIMO
分类号 H01L23/544;G01R31/28;G01R31/303;G08C17/02;H01L21/00 主分类号 H01L23/544
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