发明名称 |
WAFER, METHOD OF MANUFACTURING INTEGRATED CIRCUITS ON A WAFER, AND METHOD OF STORING DATA ABOUT SAID CIRCUITS |
摘要 |
The invention discloses a wafer (2), comprising a plurality of integrated circuits (1) formed on the wafer (2); and at least one auxiliary integrated circuit (Ia) formed on the wafer (2); wherein data carrying information about said integrated circuits (1) are stored in said at least one auxiliary integrated circuit (Ia). Examples for said data are test results of a test performed on said individual integrated circuits (1) and/or a wafer identification or a product identification. The invention furthermore discloses a method of manufacturing said integrated circuits (1) and a method of storing said data about said circuits (1a). |
申请公布号 |
WO2009034496(A3) |
申请公布日期 |
2009.05.22 |
申请号 |
WO2008IB53499 |
申请日期 |
2008.08.29 |
申请人 |
NXP B.V.;SCHEUCHER, HEIMO |
发明人 |
SCHEUCHER, HEIMO |
分类号 |
H01L23/544;G01R31/28;G01R31/303;G08C17/02;H01L21/00 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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