| 摘要 |
PROBLEM TO BE SOLVED: To solve the problems that a device for curving mounting boards has required a large scale and high costs in a conventional apparatus for inspecting soldered state and that it has been difficult to detect soldering defects of the overall area of a mounting board since the mounting board is not uniformly curved. SOLUTION: An electronic apparatus 10 includes both a mounting board 20 to which electronic components 26 are soldered and mounted and a case 11 for housing the mounting board 20. The circumference of the mounting board 20 is supported by the case 11. A first space 11A and a second space 11B partitioned by the mounting board 20 are formed in the case 11. A supporting part of the mounting board 20 in the case 11 is sealed by a supporting member 12. The first space 11A and the second space 11B are constituted as sealed spaces in which air is sealed. COPYRIGHT: (C)2009,JPO&INPIT
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