发明名称 Method and system for the inspection of integrated circuit devices having leads
摘要 The invention relates to optical inspection of integrated circuit devices, such as QFP and TSOP devices. There are provided methods of inspecting objects, such as integrated circuit devices, using a single laser triangulation system oriented in a fixed direction, where the given inspection system rotates the inspection tray for scanning the objects placed therein in different directions.
申请公布号 US7535560(B2) 申请公布日期 2009.05.19
申请号 US20070678736 申请日期 2007.02.26
申请人 ACERIS 3D INSPECTION INC. 发明人 VODANOVIC BOJKO
分类号 G01N21/00 主分类号 G01N21/00
代理机构 代理人
主权项
地址