| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device which can easily position bonding materials of an appropriate amount, and can prevent a short circuit between electrodes of an LED chip. <P>SOLUTION: In the LED chip 1, electrodes are formed on both faces, and one electrode at the opposite side of a mounting board 2 side is electrically connected to a conductor pattern 21 through a bonding wire 14. The electrode at the mounting board 2 side is bonded to a mount 25b through a bonding part 12 formed of a bonding material (solder and the like) and electrically connected to the mount. In the light emitting device A, a recess for accumulating a bonding material 25c which accumulates a part of the bonding material of the bonding part 12 is formed on the surface of the mount part 25b constituting a die bonding part in the mounting board 2. At the time of mounting the LED chip 1 on the mounting board 2 for manufacturing the light-emitting device A, a block of the bonding material is arranged in the recess for accumulating the bonding material 25c, the LED chip 1 is placed and heated, and the block of the bonding material is melted. <P>COPYRIGHT: (C)2009,JPO&INPIT |
