| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip type solid electrolytic capacitor, along with its manufacturing method, having a lower surface electrode structure being excellent in connection reliability between a capacitor element and an electrode terminal. SOLUTION: A chip type solid electrolytic capacitor 20 is formed by fusion-jointing a high temperature solder 11 arranged between a positive electrode side connection terminal surface 4a of a positive electrode terminal 14 and a support member 3, using laser radiation through an light absorbing layer 10 provided on the surface where a positive electrode lead 2 of the support member 3 is connected. COPYRIGHT: (C)2009,JPO&INPIT
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