CONDUCTIVE BONDING MATERIAL AND ELECTRONIC DEVICE

摘要

An electroconductive bonding material contains a thermosetting resin 7, a low-melting-point metal powder 8 which is melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin 7, a high-melting-point metal powder 9 which is not melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin 7 and which reacts with the low-melting-point metal powder 8 to form a reaction product having a high melting point of 300°C or higher during heat-hardening of the thermosetting resin 7, and a reducing substance which removes an oxide formed on the surface of the high-melting-point metal powder 9. The total content of the low-melting-point metal powder 8 and the high-melting-point metal powder 9 is 75% to 88% by weight, and the particle size ratio D1/D2 of the average particle size D1 of the low-melting-point metal powder 8 to the average particle size D2 of the high-melting-point metal powder 9 is 0.5 to 6.0. Thereby, it is possible to provide an electroconductive bonding material which has good conduction properties and high connection strength even when reflow heat treatment is repeatedly carried out or thermal shock accompanied with a rapid temperature change is applied to the electroconductive bonding material, and an electronic apparatus using such an electroconductive bonding material.