| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that remarkably improves processing accuracy and processing capability. SOLUTION: The substrate processing apparatus includes a substrate holding mechanism which holds a substrate to be processed and a processing head provided with a groove to which a part of a periphery of the substrate that is held by the substrate processing mechanism is inserted, and it processes the substrate by inserting the periphery of the substrate into the groove. The processing head includes: first and second supply ports 13A and 14A which are connected with a pair of first and second flanges 8A and 8B facing each other at predetermined intervals, a back wall 8C for connecting the ends of the first and second flanges and a processing liquid supply means for supplying a processing liquid; and a suction port 11A connected with a pressure-reducing and suction means. The first supply port and the suction port are provided within the groove, and the second supply port is provided adjacent to an opening 9A of at least either of the first and second flanges. COPYRIGHT: (C)2009,JPO&INPIT
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