| 摘要 |
PROBLEM TO BE SOLVED: To more inexpensively cool a substrate while conveying the substrate using a conveying roller. SOLUTION: A cooling processing section 1C is configured so that the substrate S after heat processing is cooled with the conveying roller 14 while conveying the substrate S using the conveying roller 14. That means, usual-temperature cooling water is splashed into the inside of the conveying roller 14 using a nozzle 26 while conveying the substrate S by the conveying roller 14, and the cooling water is vaporized (evaporated) using heat of the conveying roller 14 and discharged to the outside, thereby cooling the conveying roller 14. Thus, the substrate S is cooled. COPYRIGHT: (C)2009,JPO&INPIT |
