发明名称 Device package structure, device packaging method, liquid drop ejection method, connector, and semiconductor device
摘要 A device package structure includes: a base body having a depression portion and a conductive connection portion formed in the depression portion; a device having a connection terminal; and a connector having a plate portion having a first surface on which the device is positioned, a protruding portion protruding from the first surface of the plate portion and having a second surface different from the first surface, a terminal electrode formed on the second surface, and a connection wiring electrically connecting the connection terminal of the device and the terminal electrode, wherein the protruding portion of the connector is inserted into the depression portion of the base body, the terminal electrode is connected to the conductive connection portion, and the conductive connection portion is electrically connected to the connection terminal of the device.
申请公布号 US7527356(B2) 申请公布日期 2009.05.05
申请号 US20060370018 申请日期 2006.03.06
申请人 SEIKO EPSON CORPORATION 发明人 SATO EIICHI
分类号 B41J2/14;B41J2/16 主分类号 B41J2/14
代理机构 代理人
主权项
地址