发明名称 |
METHOD AND SYSTEM FOR CHEMICALLY ENHANCED LASER TRIMMING OF SUBSTRATE EDGES |
摘要 |
An apparatus for processing a peripheral portion of a substrate includes a housing and a spin chuck mounted within the housing and configured to support the substrate in a substantially horizontal orientation. The apparatus also includes a fluid dispense nozzle coupled to the housing and proximate to the peripheral portion of the substrate. The fluid dispense nozzle is in fluid communication with a source of a chemical and configured to direct a flow of the chemical to the peripheral portion of the substrate located at a first radial distance from a center of the substrate. The apparatus further includes a light guide optically coupled to a laser source. The light guide is configured to direct radiation to the peripheral portion of the substrate located at a second radial distance from the center of the substrate greater than the first radial distance.
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申请公布号 |
US2009107519(A1) |
申请公布日期 |
2009.04.30 |
申请号 |
US20070929186 |
申请日期 |
2007.10.30 |
申请人 |
SOKUDO CO., LTD. |
发明人 |
ISHIKAWA TETSUYA;MITSUHASHI TSUYOSHI;XI MING |
分类号 |
B08B7/04 |
主分类号 |
B08B7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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