发明名称 SEMICONDUCTOR PRODUCTION DEVICE AND METHOD FOR PROCESSING LOADING AND UNLOADING WAFER BY SETTING VARIABLE SLOT THEREFOR
摘要 <p>A semiconductor manufacturing device for loading/unloading a wafer by a variable setting of a wafer slot and a method thereof are provided to prevent an error generation of a wafer due to falling of particles by randomly setting a wafer. A wafer slot selection mode is set in advance. When the wafer slot selection mode is set to a random mode, a wafer is loaded by a preset slot selection sequence(308). When a loading of the wafer is completed, a loaded wafer is transferred to a process device and a run process is carried out(309). The wafer of the result is unloaded by the preset slot selection sequence(310). A screen for setting the wafer slot selection mode is displayed by carrying out a wafer slot selection setting program.</p>
申请公布号 KR20090041883(A) 申请公布日期 2009.04.29
申请号 KR20070107622 申请日期 2007.10.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, JONG BUM;SHIN, KWANG HEE
分类号 H01L21/68;H01L21/677;H01L21/683;H01L21/687 主分类号 H01L21/68
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