| 摘要 |
The present invention provides a temperature measuring apparatus with favorable temperature measuring performance and a method of manufacturing the same. A temperature measuring apparatus (10) provided with a temperature sensor (11) arranged on a bottom surface of a depressed section (12c) of a semiconductor wafer (12). The semiconductor wafer (12) and temperature sensor (11) are contacted together through a first contact layer (14) and second contact layer (24). The first and second contact layers (14) and (24) are formed from the same material, concretely a metal with high heat conductivity, and formed to provide virtually even thickness in surface direction. By such first and second contact layers (14) and (24), heat is conducted from the semiconductor wafer (12) to the temperature sensor (11) favorably. Therefore, the temperature measuring apparatus (10) has favorable temperature measuring performance.
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