ELECTRONIC COMPONENT LAMINATE, LEAD FRAME, ELECTRONIC DEVICE HAVING LEAD FRAME, AND THEIR MANUFACTURING METHODS

摘要

PROBLEM TO BE SOLVED: To provide an electronic component laminate capable of identifying fluid to be identified precisely and accurately by suppressing stress applied to electronic components packaged at an electronic component packaging section from a mold resin as much as possible, to provide a lead frame and an electronic device having the lead frame, and to provide their manufacturing methods.

SOLUTION: The electronic component laminate comprises: the electronic component packaging section for packaging an electronic component; the electronic component packaged in the electronic component packaging section, and a coating layer formed at the electronic component.

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