| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-dissipating structure capable of efficiently providing heat dissipation for an electronic device wherein an insulating substrate mounted with a heating device, and to provide a heat-dissipating member are connected via a heat conduction material. SOLUTION: In the electronic device 10 equipped with the heating device 16, the insulating substrate 14 mounted with the heating device on a mounted surface 14a, and the heat dissipation member 12 connected to the reverse surface 14b, opposed to the mounted surface of the insulating substrate via the heat conducting member 26, the insulating substrate is provided with heat conductive material escape portions 24, 34, 44, 54, 64, 74, 84, and 94 which release the conducting material nearby the heating device. COPYRIGHT: (C)2009,JPO&INPIT |
