LIGHT EMITTING DIODE PACKAGE

摘要

A light emitting diode package is provided to simplify a manufacturing process by forming a heat sink and an electrode including a LED chip through a stamping process of metal plate. A light-emitting diode package(100) comprises a LED chip(110), a heat sink(120), an electrode(130), a housing(140), and molding unit. The LED chip is mounted at one side of the heat sink and is connected with the electrode. The heat sink radiates heat generated from the LED chip while being formed through stamping of a metal plate. The height of a place of which heat sink is mounted is lower than that of the electrode by a deep downset. The housing is external member of the light emitting diode and is used for supporting the package of the LED. A place for receiving a molding part(150) is formed at the upper part of the housing.