发明名称 Electromagnetic interference shields and related manufacturing methods
摘要 According to various aspects, exemplary embodiments are provided of board level shields having single piece constructions. In an exemplary embodiment, a shielding enclosure includes sidewalls and an integral top surface. The sidewalls include upper and lower portions cooperatively defining an interlock therebetween. The upper sidewall portions depend downwardly from the integral top surface. The interlock releasably attaches the integral top surface and upper sidewall portions to the lower sidewall portions. By disengaging the interlock, the integral top surface and upper sidewall portions may then be completely separated from the lower sidewall portions. The integral top surface and upper sidewall portions may also be reattached to the lower sidewall portions by engagement of the interlock.
申请公布号 US7504592(B1) 申请公布日期 2009.03.17
申请号 US20070848923 申请日期 2007.08.31
申请人 LAIRD TECHNOLOGIES, INC. 发明人 CROTTY, JR. PAUL W.
分类号 H05K9/00 主分类号 H05K9/00
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