An LED package comprises the bonding wire with the copper core part and the metal coating layer to improve the electric conduction and heat conduction of the bonding wire. The LED package(10) comprises the LED chip(16), and the package body(13) and the bonding wire(17). Current is applied to the LED chip through the leads of the package body. The bonding wire connects to the lead and the LED chip. The bonding wire comprises the core unit(17a) and metal coating layer(17b). The core unit of the bonding wire is formed with copper. The metal coating layer is formed in the surface of the core unit and supplements the optical property of the core unit.
