| 摘要 |
A heat spreader is provided to maximize the efficiency of the heat release by reducing the deviation of the heat release generated in the crack and memory module. A heat spreader(200) is composed of a non conductive film (210) and thermal conductive metal (220). The non conductive film is attached on the semiconductor package(230). A thermal interface material(260) is interposed and the heat of the semiconductor package is released. A Thermal interface material is interposed in the lower part of the thermal conductive metal. A thermal conductive metal is inserted into the opened part of the non conductive film.
|
