APPARATUS AND METHOD FOR MANUFACTURING PRINTED CIRCUIT SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide an apparatus and a method for manufacturing a printed circuit substrate in which a roller can be maintained in a clean state by using a cleaning device without providing other means for performing a cushion function and a release function between a bump and the roller.

SOLUTION: The apparatus for manufacturing a printed circuit substrate is an apparatus for manufacturing a printed circuit substrate in which inter-layer connection is made by means of conductive bumps, including: a transfer portion 30 which transfers the substrate having conductive bumps formed on one of its surfaces; an upper roller 10 and a lower roller 20 which press-bond the substrate 40 having the conductive bumps 50 with an insulator 60; an elastic coating layer 12 formed on a surface of the upper roller 10; and a cleaning device which removes foreign materials on the surface of the elastic coating layer 12.

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