发明名称 DEW CONDENSATION PREVENTION STRUCTURE FOR PIPING
摘要 PROBLEM TO BE SOLVED: To provide a dew condensation prevention structure for piping, preventing decrease in thickness of a coating layer formed of a heat insulating covering material to overcome various disadvantages such as dew condensation, generation of mildew or lowering of heat insulation effect due to decrease in thickness, and inexpensively achieving the above effect. SOLUTION: This structure includes: a suspending band 10 for supporting a pipe P whose outside is provided with the coating layer Q together with the coating layer; and a plate-like plate receiving member 20 mounted on the outer surface of the coating layer Q coming into contact with a band part 11 of the suspending band 10 and having a larger area than the width of the band part 11. A temporarily stopping locking groove 21 is formed at the end of the plate receiving member 20 coming into contact with the coating layer Q side of the band part 11. The plate receiving member 20 is temporarily stopped to the inside of the band part 11 by the locking groove 21. The pipe P is supported by the band part 11 where the plate receiving member 20 is mounted. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009052611(A) 申请公布日期 2009.03.12
申请号 JP20070218221 申请日期 2007.08.24
申请人 BUREST KOGYO KENKYUSHO CO LTD;FUJI GRIP:KK 发明人 SAKURAI HIROSHI;SUGAYA KEIICHI;SHIMIZU FUJIO
分类号 F16L3/14 主分类号 F16L3/14
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