| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of marking a semiconductor chip by which missing marking can be surely detected, and to provide a method of manufacturing a semiconductor chip using the same. SOLUTION: This marking method is used to mark a semiconductor chip 10 having a marking pad 11 on its surface by mans of a probe card 30 with a plurality of probe needles 31 and 32. It includes a step to supply a semiconductor wafer with a conduction point 12 provided on its surface or rear surface to be electrically conductive with the marking pad 11, to the opposite position to the probe card 30; and a marking step to bring a first probe needle 31 in contact with the marking pad 11 to make a needle mark, bring the second probe needle 32 in contact with the conduction point for conduction testing, and perform marking while checking the first probe needle 31 for its contact with the marking pad. COPYRIGHT: (C)2009,JPO&INPIT
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