LED Bonding Structures and Methods of Fabricating LED Bonding Structures

摘要

A method is disclosed for fabricating an LED The method includes providing an LED chip having an epitaxial region comprising at least a p-type layer and an n-type layer, an ohmic contact formed on at least one of the p-type layer or the n-type layer, and a bond pad formed on the ohmic contact. The bond pad has a total volume less than about 3x10-5 mm3. The LED chip is bonded to a submount via thermocompression or thermosonic bonding.