发明名称 |
Device for solid state thermal transfer and power generation |
摘要 |
A solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. The solid state thermal transfer device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.
|
申请公布号 |
US7498507(B2) |
申请公布日期 |
2009.03.03 |
申请号 |
US20050081986 |
申请日期 |
2005.03.16 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
WEAVER, JR. STANTON EARL;WOJNAROWSKI ROBERT JOHN |
分类号 |
H01L35/30;H02N10/00 |
主分类号 |
H01L35/30 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|