发明名称 Device for solid state thermal transfer and power generation
摘要 A solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. The solid state thermal transfer device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.
申请公布号 US7498507(B2) 申请公布日期 2009.03.03
申请号 US20050081986 申请日期 2005.03.16
申请人 GENERAL ELECTRIC COMPANY 发明人 WEAVER, JR. STANTON EARL;WOJNAROWSKI ROBERT JOHN
分类号 H01L35/30;H02N10/00 主分类号 H01L35/30
代理机构 代理人
主权项
地址
您可能感兴趣的专利