Semiconductor wafer surface e.g. front side or rear side, inspecting method for detecting defects on wafer surface, involves processing parameter or type of image receiving for area fixed on surface with detection sensitivity of area

摘要

The method involves recording an image of a selected surface e.g. front side or rear side, of a wafer with a detector e.g. surface sensor, and displaying the image on a display (7). An area is fixed on the surface over the display with an input unit. The area with the detection sensitivity is processed as a rest of the wafer, where the sensitivity represents a percentage value. The value is smaller than the sensitivity for the surface without the area with the sensitivity. A parameter or a type of image receiving is fixed for the area, and is processed with the area's sensitivity.