Method for embedding at least one component in a printed circuit board element

摘要

Circuit board element has an electrical or electronic component e.g. thinned chip (2), incorporated or drowned between a lower base layer (4) and a covering layer (6). The chip is stuck using an adhesive film section (3) on the lower layer, where the adhesive film section is hardened by heating. The chip is contacted or connected through the covering layer having a synthetic resin layer. An independent claim is also included for a method for incorporating or drowning an electrical or electronic component in a printed circuit board element.