| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin composition having sufficient mechanical properties, low warpage property and welding strength as a thin molded product, and to provide a polyamide resin composition having appropriate physical properties for a member to which strength is required although the member is thin such as automobile parts and housings and chassis of electronic equipment. SOLUTION: The polyamide resin composition is prepared by compounding 10 to 50 parts by mass of flat glass fibers having a flat cross section with a major axis/minor axis ratio of 1.5 to 10 into 100 parts by mass of polyamide resin comprising dispersion of silicate layers of a swelling sheet silicate, wherein 0.05 to 4.0 part by mass of an organic compound having two or more functional groups in one molecule is compounded into the polyamide resin composition. COPYRIGHT: (C)2009,JPO&INPIT
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