| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a sensor device capable of securing an electric connection state between a sensor chip and an external connection lead, and suppressing a damage sustained by a thin-walled part or a fluctuation of sensor characteristics. <P>SOLUTION: This sensor device includes the sensor chip wherein a detection part and a wiring part connected to the detection part are formed on a substrate having a hollow part, and a resister constituting the detection part is formed on the thin-walled part on the hollow part; a support lead which is a part of a lead frame, wherein the sensor chip is fixed through an adhesive member on one surface with the opened under surface of the hollow part as a loading surface, and the external connection lead connected electrically to the wiring part; and a sealing member comprising an insulating material, and arranged integrally to cover a connection portion between the wiring part and the external connection lead, while exposing the detection part and the thin-walled part. A plurality of adhesive members having each mutually-different Young's modulus are arranged side by side between the sensor chip and the support lead as the adhesive members, and the sensor chip is fixed to the support lead through the plurality of adhesive members. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
