发明名称 Polysilicon semiconductor thin film substrate, method for producing the same, semiconductor device, and electronic device
摘要 A semiconductor device and a method of manufacture thereof by forming an amorphous semiconductor film on the surface of an insulative substrate, and irradiating the amorphous semiconductor film with a laser beam to crystallize it to form a polycrystalline semiconductor thin film. A transistor is then formed in the polycrystalline semiconductor thin film. More specifically, a UV-ray is irradiated to the rear face of the insulative substrate or the amorphous semiconductor film to heat the amorphous semiconductor film to a melting temperature or lower. Then a laser beam at a suitable shape selection laser energy density Ec forms the crystal grains with the number of closest crystal grains of 6 most predominantly being irradiated to convert the amorphous semiconductor film into a polycrystalline semiconductor thin film. The thin film transistor formed in this structure has a high yield and is capable of high-speed operation.
申请公布号 US7491972(B1) 申请公布日期 2009.02.17
申请号 US20000019407 申请日期 2000.06.23
申请人 HITACHI, LTD. 发明人 KIMURA YOSHINOBU;KAMO TAKAHIRO;KANEKO YOSHIYUKI
分类号 H01L21/00;H01L21/20;H01L21/336 主分类号 H01L21/00
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