发明名称 Apparatus for removing heat from a circuit
摘要 <p>An apparatus includes a circuit (47) having a heat-generating circuit component, and structure for guiding a two-phase coolant along a path which brings the coolant into direct physical contact with either the circuit component or a highly thermally conductive part (121,122) which is thermally coupled to the circuit component. The coolant absorbs heat generated by the circuit component, at least part of the coolant changing from a first phase to a second phase in response to the heat absorbed from the circuit component, where the second phase is different from the first phase. <IMAGE></p>
申请公布号 EP1381083(B1) 申请公布日期 2009.02.11
申请号 EP20030254283 申请日期 2003.07.05
申请人 RAYTHEON COMPANY 发明人 HAWS, JAMES L.;WYATT, WILLIAM GERALD;KVIATKOFSKY, JAMES F.;DENNISTON, DAVID B.
分类号 H01L23/427;H01Q1/02;H01Q21/00;H05K7/20 主分类号 H01L23/427
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