| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable composition which is excellent in workability, general adhesiveness and thermal adhesion resistance, has a long pot life when applied, and is useful as a moisture-curing type reactive hot-melt adhesive little in toxicity. SOLUTION: This curable composition comprising a reactive silicon group-having oxyalkylene-based polymer (A), an alkyl (meth)acrylate-based (co)polymer (B), a tackifying resin (C), a filler (D) and/or a thixotropy-imparting agent (E), and a curing catalyst (F), is characterized in that the composition ratio of the reactive silicon group-having oxyalkylene-based polymer (A)/the alkyl (meth)acrylate-based (co)polymer (B) is 20/80 to 65/35; and the tackifying resin (C), the filler (D) and/or the thixotropy-imparting agent (E), and the curing catalyst (F) are contained in amounts of 10 to 100 pts.wt., 5 to 200 pts.wt. and/or 1 to 60 pts.wt., and 0.1 to 20 pts.wt., respectively, per 100 pts.wt. of the total amount of ((A)+(B)). COPYRIGHT: (C)2009,JPO&INPIT |
