| 摘要 |
<p>A semiconductor device and a method of manufacturing the semiconductor device are provided to maintain the contacting state between the metal pad and the metal contacts which successively is laminated. A semiconductor device(100) comprises a lower structure(110), an insulating layer(130), a metal contact(140), a bridge(150), a glue layer(160), and a metal pad(170). The lower structure has a metal wiring(120). The insulating layer is arranged on the lower structure in order to be covered on the metal wiring. The metal contacts contact the metal wiring through the insulating layer. The bridge is positioned in the insulating layer and connects the metal contacts. The metal pad is located on the insulating layer and contacts with the metal contacts.</p> |
