| 摘要 |
A probe card is provided to reduce a signal transmission path from a main board to a probe, thereby reducing external noise effects and minimizing manual works when manufacturing the probe card. A probe card comprises the followings. A probe(200) is contacted with an electrode pad of a semiconductor chip so as to determine whether a fault is generated in the semiconductor chip. In a probe guide(250), a hole(260) for receiving the probe is formed in order to support the probe. A ceramic substrate(300) is connected to the probe so as to transmit an electric signal to the probe. An interposer(400) includes an interconnect(400A) which is connected to the ceramic substrate so that the electric signal can be delivered to the ceramic substrate. A main board(500) is connected to the interconnect of the interposer so that the electric signal can be delivered to interposer. A post(210) is formed with a predetermined height. A beam(220) is extended in one side direction as being connected with the post. A tip(225) is formed in one end of the beam to be opposite to the post. The ceramic substrate is connected to the probe through the post.
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