| 摘要 |
PROBLEM TO BE SOLVED: To improve heat dissipation performance while keeping light weight and low cost. SOLUTION: A structure is employed in which metal foil 1 is provided to be thermally connected with a semiconductor chip 5 on a surface in opposition to a surface in contact with a heat sink 2 on a flexible board 4, and the metal foil 1 is screwed to the heat sink 2 using a screw 3a. Such a structure transfers the heat generated by the semiconductor chip 5 to the heat sink 2 via a heat dissipation material 5a from one face of the semiconductor chip 5, while transferring the heat to the heat sink 2 via the metal foil 1 from the other face of the semiconductor chip 5. In such a way, the heat can be transferred to the heat sink 2 from the two-face direction of the semiconductor chip 5, thus allowing the heat dissipation performance to be improved without significantly increasing the number of components and set weight. COPYRIGHT: (C)2009,JPO&INPIT
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