LIGHT EMITTING DIODE PACKAGE

摘要

A light emitting diode package is provided to improve light emitting efficiency by improving reflexibility of an inner wall of a cavity. A first lead terminal(21) has a chip mounting region(21a), a first external lead and a first wing part. A second lead terminal(23) is separated from the first lead terminal. The second lead terminal has a wire bonding region(23a), a second external lead and a second wing part. A package body(25) is combined in the first and second lead terminals and supports the first and second lead terminals. The chip mounting region and the wire bonding region are positioned in the bottom of the cavity. The first wing part and the second wing part are arranged in both sides of the chip mounting region to form both reflective surfaces. The inner wall defining the cavity is formed by the package body and the first and second wing parts.