发明名称 ADHESIVE-CONVEYOR-TOOL-APPLICABLE METAL MASK AND METHOD OF SOLDER-PRINTING SUBSTRATE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain an adhesive-conveyor-tool-applicable metal mask reducing adhesion of a part protruding from a substrate outline on a side of a substrate contact surface of the metal mask to an adhesive part of an adhesive conveyor tool in cream-solder-printing a substrate, enabling a plate to smoothly separate and shortening tact time. SOLUTION: The adhesive-conveyor-tool-applicable metal mask 3 to be used in cream-solder-printing the substrate has a frame-like recess 31 formed to avoid contact with the adhesive part of the adhesive conveyor tool in squeezing within an adhesive part contact region of the tool on the side of the substrate contact surface of the metal mask and except the substrate contact part. The size of the outer periphery of the frame-like recess is structured to be smaller than an outer peripheral region of the adhesive part of the adhesive conveyor tool. Numerous micro recesses 34 for reducing a contact area are formed along a flat inner periphery of the periphery of the metal mask in contact with the outer peripheral region of the adhesive part of the tool at squeezing. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009016457(A) 申请公布日期 2009.01.22
申请号 JP20070174526 申请日期 2007.07.02
申请人 BONMAAKU:KK 发明人 KATSUYAMA EIICHI
分类号 H05K3/34;B23K1/00;B23K3/06;B23K101/42;B41M1/12;B41N1/24 主分类号 H05K3/34
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