| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for use as a sealing material for an optical element, which solves problems of heat resistance and brittleness in the cured product of the conventional epoxy resin, which can give a cured product being excellent in heat resistance, light stability, hygroscopicity, adhesion and colorless-transparency and having sufficient strength, and is useful in particular as a sealing material for the LED emitting light having a short wavelength. <P>SOLUTION: The epoxy resin composition for use as a sealing material for an optical element comprises a component (A): an alicyclic epoxy resin, a component (B): an epoxy resin produced from a polyether glycol and a component (C): one or more kinds of curing agents selected from the group consisting of an acid anhydride, a modified product of the acid anhydride and a cationic polymerization initiator, wherein the content of the component (A) is 99-50 mass% based on the total epoxy resin components and the content of the component (B) is 1-50 mass% based on the total epoxy resin component. <P>COPYRIGHT: (C)2009,JPO&INPIT |
