COPPER FOIL PROVIDED WITH CARRIER SHEET, METHOD FOR FABRICATING COPPER FOIL PROVIDED WITH CARRIER SHEET, SURFACE-TREATED COPPER FOIL PROVIDED WITH CARRIER SHEET, AND COPPER-CLAD LAMINATE USING THE SURFACE-TREATED COPPER FOIL PROVIDED WITH CARRIER SHEET

摘要

There is provided a copper foil provided with a carrier sheet, in which the carrier and the copper layer can be peeled from each other even when it is used for the fabrication of a printed circuit board in which press work is performed at a temperature of 300 °C or more. The copper foil has a bonding interface layer formed on the surface of the carrier sheet and a copper layer formed on the bonding interface layer. The carrier sheet is capable of being physically peeled off, and the bonding interface layer is composed of a metal layer and a carbon layer. In addition, the bonding interface layer preferably comprises the metal layer having a thickness of 1 nm to 50 nm and the carbon layer having a thickness of 1 nm to 20 nm.