发明名称 |
C4NP COMPLIANT SOLDER FILL HEAD SEALS |
摘要 |
A seal, fill head, and system are provided. The seal is adapted to cooperate with a fill head that is configured to place conductive bonding material into cavities on a mold. The seal comprises a first outer wall that is configured to abut a first adjacent wall of a support groove in a fill head. A second outer wall is configured to abut a second adjacent wall of a support groove in a fill head. An outer horizontal wall is situated between the first outer wall and the second outer wall. The outer horizontal wall comprises at least a first portion that is configured to abut an upper portion of the support groove. A convex bottom portion extends from the first and second outer walls. The convex bottom portion is configured to cooperate with a top surface of a mold. |
申请公布号 |
US2009014146(A1) |
申请公布日期 |
2009.01.15 |
申请号 |
US20070774713 |
申请日期 |
2007.07.09 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BUDD RUSSELL A.;KARIDIS JOHN P. |
分类号 |
B22D35/04;B22D25/02;F16L17/06 |
主分类号 |
B22D35/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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