| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer flexible wiring board that is high in high-frequency characteristics and superior in dimensional stability with respect to temperature changes. SOLUTION: The multilayer flexible wiring board has a flexible region F. Each insulating layer 3 is formed on both surfaces of a core material 2, having each conductor circuit 1 on its both surfaces. Other conductor circuits 4 are respectively formed on the surface of each insulating layer 3, in each region R other than the flexible region F. Each insulating layer 3 in the flexible region F is formed as a coverlay function part C. Each insulating layer 3 is formed of a liquid-crystal polymer. COPYRIGHT: (C)2009,JPO&INPIT |
