发明名称 |
ACTIVATED PLASMA PROCESSING APPARATUS |
摘要 |
The activated plasma processing apparatus is provided to uniformly supply the plasma generation gas to the substrate and to improve the uniformity of the thin film. The plasma processing apparatus is connected with a plurality of plasma generation gas supply tubes(202) supplying the plasma generation gas. The manifold(220) is to keep the plasma generation gas. The shutter(210) and the RF antenna(107) are to seal the plasma generation gas at the manifold. A plurality of plasma generation gas introduction tubes(102) comprises the plasma generation part(110), DC bias generation unit(120), the first showerhead(130), the source/purge gas introduction portion(140), the second shower head(150).
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申请公布号 |
KR20090005535(A) |
申请公布日期 |
2009.01.14 |
申请号 |
KR20070068652 |
申请日期 |
2007.07.09 |
申请人 |
IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) |
发明人 |
JEON, HYEONG TAG;KIM, SEOK HOON;WOO, SANG HYUN;KIM, HYUNG CHUL |
分类号 |
H01L21/205 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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