| 发明名称 |
Electronic and optoelectronic component packaging technique |
| 摘要 |
A packaging method including assembling components on a substrate, manufacturing a lid assembly to include a plurality of integrated covers, and mating the lid assembly to the substrate.
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| 申请公布号 |
US7476566(B2) |
申请公布日期 |
2009.01.13 |
| 申请号 |
US20050101925 |
申请日期 |
2005.04.08 |
| 申请人 |
FOSTER-MILLER, INC. |
发明人 |
FARRELL BRIAN;JAYNES PAUL;TAYLOR MALCOLM |
| 分类号 |
H01L21/50;H01L21/44;H01L21/48;H01L23/04;H01L23/06;H01L23/10;H01L23/12;H01L23/31 |
主分类号 |
H01L21/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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