CMP APPARATUSES WITH POLISHING ASSEMBLIES THAT PROVIDE FOR THE PASSIVE REMOVAL OF SLURRY
摘要
<p>Chemical mechanical planarization apparatuses with polishing assemblies that provide for the passive removal of slurry are provided. In accordance with an embodiment, a work piece polishing assembly comprises a polishing pad comprising a polishing surface and an exhaust aperture that extends through the polishing pad from the polishing surface and is configured to receive a slurry from the polishing surface. An underlying member is disposed underlying the polishing pad and comprises a peripheral surface. The underlying member comprises a channel that is in fluid communication with the aperture and that is open at the peripheral surface of the underlying member.</p>
申请公布号
WO2009002351(A1)
申请公布日期
2008.12.31
申请号
WO2007US73249
申请日期
2007.07.11
申请人
NOVELLUS SYSTEMS, INC.;O'MOORE, FERGAL;SCHULTZ, STEVE;SEVERSON, BRIAN