发明名称 |
Method of providing a low-stress sensor configuration for a lithography-defined read sensor |
摘要 |
One illustrative method of fabricating a read sensor of a magnetic head includes the steps of forming a plurality of read sensor layers on a wafer; etching the read sensor layers to form a read sensor structure with a trench in front of the read sensor structure; forming a highly porous material within the trench; and slicing the wafer and lapping the sliced wafer through the highly porous material until an air bearing surface (ABS) of the magnetic head is reached. Advantageously, the highly porous material in front of the read sensor structure reduces mechanical stress on the read sensor during the lapping process. This reduces the likelihood that the amplitude of the read sensor will be degraded or set in a "flipped" or reversed orientation, as well as reduces the likelihood that electrostatic discharge (ESD) damage to the read sensor will occur.
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申请公布号 |
US7469465(B2) |
申请公布日期 |
2008.12.30 |
申请号 |
US20040881581 |
申请日期 |
2004.06.30 |
申请人 |
HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V. |
发明人 |
DING MENG;HO KUOK SAN;LIN TSANN;TZENG HUEY-MING |
分类号 |
G11B5/187 |
主分类号 |
G11B5/187 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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