| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chemical-mechanical polishing device of optimizing polishing efficiency, flatness uniformity, and a degree of final finish while minimizing the risk of contamination or damages of a substrate. <P>SOLUTION: A substrate retaining ring 166 used for the polishing device comprises: a lower surface for abutting to a polishing pad 135 at the time of polishing; a cylindrical inner surface adjacently arranged to a peripheral part of a mounting surface for the substrate 113; and a transition area, positioned in a ring outer peripheral part, and provided between a first flat surface 124 substantially in parallel with a nominal flat surface of the polishing pad and a second flat surface 125 perpendicular to the nominal flat surface of the polishing pad. The substrate retaining ring is characterized by the transition area planarly inclined at 15-25 degrees to the parallel direction of the nominal flat surface of the polishing pad. <P>COPYRIGHT: (C)2009,JPO&INPIT |
