| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an encapsulating resin composition for preapplication which has a good wetting property toward the boundary of a semiconductor chip or a circuit substrate plate, has less repellance, and also is excellent in workability and reliability on mounting the semiconductor chip on the circuit substrate plate, and also a semiconductor device excellent in reliability by applying the encapsulating resin composition for the preapplication. <P>SOLUTION: This encapsulating resin composition for the preapplication comprises (A) an epoxy resin, (B) a curing agent having a flux activity and (C) a surfactant and has a≤40°contact angle with gold to heat-melting the composition at 160°C for 20 s on the gold and a solder resist, and also having≤40°contact angle with the solder resist. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
