| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for a semiconductor device in which leakage failures and alignment aberrations are less apt to be produced. SOLUTION: A package for a semiconductor device comprising: a metal substrate 1, including a mounting portion 2 on which the semiconductor device is mounted; a metal frame 3 having a rectangular cross section, jointed to the top face of the metal substrate 1 around the mounting portion 2; and a metal lid joined to the top face of the metal frame 3, wherein at least two opposing sides out of four sides of the top face of the metal frame are curved concave so that seam welding can be performed in just the correct proportion at corner portions 5 and at four sides due to mutual pressing force at the corners, when the lid and a sealing ring are engaged, resulting in small current welding which is less likely to cause leakage failures and alignment aberrations. COPYRIGHT: (C)2009,JPO&INPIT
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