| 摘要 |
NEW MATERIAL:A polyepoxy compound composed of polynuclear polyhydric phenol polyglycidyl ether of formula I (R<1>, R<3>, and R<4> are each lower alkyl; R<2> is H or lower alkyl; R<5> and R<6> are each H, lower alkyl or halogen). EXAMPLE:A compound of formula II. USE:Curing agent incorporation will result in an epoxy resin-curable composition of high heat resistance, which is used in the manufacture of laminates for printed circuit. PREPARATION:A polynuclear polyhydric phenol of formula I and an epihalohydrin are made to react in the presence of a catalyst (e.g., NaOH, propylamine) to form a halohydrin ether of said phenol followed by reaction of the ether with an alkali hydroxide, thus obtaining the objective polyepoxy compound.
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