| 摘要 |
PURPOSE:To obtain a package characterized by a low height when it is mounted on a printed board, good heat resistance and airtight property, by providing glass as an insulating material at the lower surface of a body comprising a metal plate, providing a plurality of electrodes, which are contacted with the lower surface or the side surface, penetrate the glass and are extended on the body, and insulating and sealing the glass and the electrodes in an airtight manner. CONSTITUTION:Glass 6 is sealed along the lower surface of a metal body 1 to a side surface 4b. Meanwhile, electrodes 10 have flat parts 10a, which are contacted with the lower surface of the glass 6. The electrodes penetrate the inside of glass 6 and are extended on the body 1 through small holes 5 (5a) of the body 1. The electrodes 10 passing the small holes 5 other than the grounding electrode are insulated from the body 1. The grounding electrode passing through the small hole 5a is electrically connected to the body 1. On packages 20a and 20b after completion, a quartz crystal element, an IC substrate, a compound element circuit substrate and other elements are mounted. They are connected to the electrodes 10, and thereafter a cap 2 is attached. |
