| 摘要 |
NEW MATERIAL:To give stable characteristic of excellent moisture resistance and non-oxidizable characteristics without changing with the lapse of time by dividedly adding chelating agent solution at before adding silver ion solution and at the time of adding reducing agent or/and at the time of completing reaction. CONSTITUTION:After dispersing copper powder into the chelating agent solution, the silver ion solution is added into this dispersion liquid to accelerate substitution reaction, and further the reducing agent and the chelating agent are added to perfectly reduce the silver and at the same time, by-produced insoluble copper compound is made to stable copper chelate complex. Further, if necessary, successively the chelating agent is added and silver film is formed on copper powder surface. Reactional condition of substitution and deposition reaction and reduced deposition reaction can be suitably selected and changed according to kind of copper powder to be used, kind of reagent to be used, etc. This silver-coated copper powder can be available to electric conductive filler of electric conductive coating material, electric conductive paste, electric conductive resin, etc. |
