SOLDER LEVELING OF PRINTED CIRCUIT BOARD AND DEVICE

摘要

PURPOSE: To feed adequate amt. of solder to desired positions. CONSTITUTION: A method and apparatus for manufacturing finished products, such as printed circuit boards 10 include a process for blowing excess solder away from the board 10 by a hot-air type solder leveling technique. A concentrating/branching air-knife design 32 generates a shock wave for causing a high-pressure and low-speed flow pattern to remove the solder from holes of the board, while leaving sufficient solder on surface featured protrusions.